testing

Test Item

Test Condition

Reference Std.

Fine Leak

Leak rate less than 2*10-8 atm.cc/sec
MIL-STD-883 1014

Gross Leak

Leak rate less than 2*10-4 atm.cc/sec
MIL-STD-883 1014

Thermal Shock

-55℃, 125℃; soak time is 10 mins,  with total 200 cycles
MIL-STD-883 1010 Condition B

Damp Heat

85℃/85% RH for 500 hrs
JESD22-A101

Low Temp Storage

-40℃ for 500 hrs-40℃ for 500 hrs
IEC 60068-2-1
Aging

25℃, 85℃, 125℃, test in period of

1, 2, 4, 7, 10, 20, 50, 100 days

MIL-STD-883 1005 Condition A or B

MIL-STD-883   1008 Condition B

Soldering Heat

(Metal Can)

260 ± 5℃ for 10 ± 1   sec260 ± 5℃ for 10 ± 1 sec
MIL-STD-202 210 Condition B

IR Reflow

  (SMD)

Pre-heating: 150℃ to 200℃, 60~120secs.

Heating: 217℃, 60~150secs.

Peak: 260±5℃, 25±5secs. Go through twice.

J-STD-020D
Solderability

First procedure:

Steam Aging 93℃ +3/-5,

8 ± 0.5hrs.

And then:

Dipping 245±5℃ , 5 ± 0.5sec.

JESD22-B102
Mechanical Shock
1500g, half-sine, duration: 0.5ms, each axis for 3 times
MIL-STD-883 2002 Condition B
Vibration Test
10~2000Hz, 1.52mm, 20g, each axis for 4 hrs
MIL-STD-883 2007 Condition A
Salt Spray
35 ± 2℃, 5% salt   spray for 96 hrs

MIL-STD-883H

1009.8 condition C

IEC 60068-2-11
Bump Test
40g / 6ms ,each axis for 4000 times.
IEC 60068-2-29
Drop Test
70, 80, 90cm, each height for 3 times on a hardboard
IEC 60068-2-32
Bend Test
Deflection: 3mm for 30 sec
IEC 60068-2-21
Push Test
10N for 10 sec
IEC 60068-2-21
Press Test
10N for 10 sec
IEC 60068-2-21
Tensile Force
10N for 10 sec
IEC 60068-2-21